Description 

 In this position as Process Integration Engineer, your responsibilities will include but not be limited to: 
- Driving experiments to develop the wafer fabrication process used in Intel's micro process and logic designs 
- Analyzing yield, electrical parametric and fab monitor data 
- Working with Logic Technology Development (LTD) module equipment owners in fab to develop process and respond to process excursions 
 
In this position as Device Engineer, your responsibilities will include but not be limited to: 
- Analyzing electrical parametric and characterization data from process experiments 
- Designing and characterizing test structures on development test chips which validate layout design rules and circuit performance goals 
- Developing device architecture which meets technology performance, reliability and yield goals 
- Interfacing with process integration and circuit design groups to understand requirements for the development of a high performance process technology 

 
 

 Qualifications 

 You must possess a Ph.D. in Electrical or Chemical Engineering, Materials Science, Chemistry or Physics. Additional qualifications include: 
- Process integration position: Research or relevant job experience in areas pertaining to wafer fabrication such as Electrical Engineering, Chemistry, Chemical Engineering and Materials Science 
- Device engineering position: Research or relevant job experience in device and/or semiconductor physics and electrical characterization techniques 



Summary

Job CategoryEngineering

LocationUSA-Oregon

 Hillsboro

Full/Part TimeFull Time

Job TypeRecent College Graduate

Regular/TemporaryRegular 



Additional Information

Posting DateFeb 21, 2008, 03:51 AM, Abidjan, Casablanca, Dakar - (UTC 0)

Apply BeforeFeb 20, 2009, 11:59 PM, Abidjan, Casablanca, Dakar - (UTC 0) 

Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly and/or test facilities.